| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board that can reduce an inductance component generated from a capacitor and make the capacitor correspond to a semiconductor chip having a variety of high frequency characteristics to reduce power supply noises caused by fluctuations of the consumption current of the semiconductor chip, to provide a method of manufacturing the same, and to provide a semiconductor device. <P>SOLUTION: A wiring pattern 25 for ground with which electrodes 28A and 29A of a plurality of capacitors 28 and 29 are connected so that a wiring pattern 25 for ground and a wiring pattern 26 for a power supply are interleaved along a predetermined direction A, and the wiring pattern 26 for the power supply with which a semiconductor chip 12 is flip-chip-connected and electrodes 28B and 29B of a plurality of capacitors 28 and 29 are connected are disposed, and a plurality of capacitors 28 and 29 are connected in parallel to the wiring pattern 25 for ground and the wiring pattern 26 for the power supply. <P>COPYRIGHT: (C)2010,JPO&INPIT |
