发明名称 |
PRINTED CIRCUIT BOARD AND LIGHT EMITTING DIODE MODULE USING THE SAME |
摘要 |
PURPOSE: A printed circuit board and an LED(Light Emitting Diode) module using the same are provided to prevent an accident due to breakdown of an insulation layer by improving a withstand voltage characteristic. CONSTITUTION: A first metal pad(110) is formed on a first side of a nonconductive material layer(140). An LED device is mounted on the first metal pad. A second metal pad(120) is formed on the first side of the nonconductive material layer. A second metal pad is electrically connected to the electrode of the LED device. A third metal pad(130) is formed on a second side of the nonconductive material layer. The third metal pad is insulated from the first metal pad and the second metal pad. A via(150) connects the first metal pad and the third metal pad by passing through the nonconductive material layer.
|
申请公布号 |
KR20100002663(A) |
申请公布日期 |
2010.01.07 |
申请号 |
KR20080062636 |
申请日期 |
2008.06.30 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
PARK, IN KYU |
分类号 |
F21S2/00 |
主分类号 |
F21S2/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|