发明名称 PRINTED CIRCUIT BOARD AND LIGHT EMITTING DIODE MODULE USING THE SAME
摘要 PURPOSE: A printed circuit board and an LED(Light Emitting Diode) module using the same are provided to prevent an accident due to breakdown of an insulation layer by improving a withstand voltage characteristic. CONSTITUTION: A first metal pad(110) is formed on a first side of a nonconductive material layer(140). An LED device is mounted on the first metal pad. A second metal pad(120) is formed on the first side of the nonconductive material layer. A second metal pad is electrically connected to the electrode of the LED device. A third metal pad(130) is formed on a second side of the nonconductive material layer. The third metal pad is insulated from the first metal pad and the second metal pad. A via(150) connects the first metal pad and the third metal pad by passing through the nonconductive material layer.
申请公布号 KR20100002663(A) 申请公布日期 2010.01.07
申请号 KR20080062636 申请日期 2008.06.30
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 PARK, IN KYU
分类号 F21S2/00 主分类号 F21S2/00
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