| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor capable of easing stress when connecting a conductive wiring member to the front surface of a pad, even if a buffer structure, such as an interlayer insulating film, is not formed directly under the pad. <P>SOLUTION: A buffer portion 5b formed of a material, which tends to have plastic deformation or elastic deformation, is projected from the lower surface of a connection terminal 5 arranged on the rear surface of a holding plate. A buffer pad 5a is arranged on the front surface of a pad 3. Stress can be relaxed by having the buffer portion 5b deformed by stresses received from the buffer pad 5a, since the buffer portion 5b pushes the buffer pad 5a, when the holding plate goes down toward a semiconductor chip 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
