| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device for assembling components each having a metal bonding pad preventing oxidation of a metal contact surface of the pad upon bonding a metal pad. <P>SOLUTION: The device for assembling 1 includes plates 2, 3. The plates 2, 3 are mutually and relatively movable, respectively hold metallic components 4, 5 and leave between the components 4, 5 a flat chamber 18 surrounding the components 4, 5 when the elements 4, 5 come into contact with each other. The flat chamber 18 can be filled with a reduction gaseous fluid G1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
