发明名称 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup device for more characteristically forming an impurity layer, and for accurately forming matching positions, and for reducing noise. SOLUTION: This solid-state image pickup device is provided with: a first conductive semiconductor layer 4 having a first main surface 4a and a second main surface 4b opposite to the first main surface 4a and an image pickup element region 100a and a peripheral region 200; a light receiving part 10 formed on the first main surface of the semiconductor layer 4 in the image pickup element 100a for storing charge by photoelectric conversion; a second conductive type first impurity layer 12 for element separation region extended, surrounding the light receiving part 10, from the first main surface 4a of the semiconductor layer 4 to the middle to the semiconductor layer 4; and a second conductive type second impurity layer 13 for element separation reaching from the second main surface 4b of the semiconductor layer 4 to the bottom section of the first impurity layer 12. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010003928(A) 申请公布日期 2010.01.07
申请号 JP20080162359 申请日期 2008.06.20
申请人 TOSHIBA CORP 发明人 KOYAMA HIROSUKE
分类号 H01L27/146;H01L27/14;H01L31/00 主分类号 H01L27/146
代理机构 代理人
主权项
地址