| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-forming apparatus which can form an alloy film containing a metal with a low melting point such as a solder, without causing a compositional deviation of the contained metal and without lowering a film-forming rate, and to provide a film-forming method therefor. SOLUTION: The film-forming apparatus has a cathode having an alloy target containing a metal with a low melting point thereon and an anode having a substrate thereon arranged in a space with a decompressed atmosphere so as to face each other. The apparatus is directed for forming the alloy film containing the metal with the low melting point on one side of the substrate with a sputtering method, and includes at least a power supply means which applies a DC pulse voltage Ek to the cathode. COPYRIGHT: (C)2010,JPO&INPIT
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