| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily and stably peeling and transferring a thin film device even when a transfer body is large-sized. SOLUTION: In the method of transferring the thin film device formed on a first substrate to a second substrate, an adhesive is formed on the thin film device, and the first substrate and second substrate are bonded together. Then, a thread or thin rod is inserted between the first substrate and second substrate and while the thread or thin rod is drawn toward the first substrate, force is applied obliquely to a second substrate normal to move the thread or thin rod in the horizontal direction of the second substrate, thereby transferring the thin film device from the first substrate to the second substrate. COPYRIGHT: (C)2010,JPO&INPIT
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