METHOD FOR CREATING MULTI-TRACE IN THROUGH HOLE OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for forming a multi-trace is provided to implement high density design of a printed circuit board by forming the multi-trace by segmenting a plated through hole. CONSTITUTION: A CCL(Copper Clad Laminate)(100) is formed by stacking a copper foil on both sides of an insulator(110). A through hole(130) is formed on the CCL by a drill process. The plated through hole is formed with the electroless copper plating and the electrolytic copper plating. The multi-trace is formed by segmenting the plating area of the plating through hole into a plurality of areas. The plating region of the plating through hole is segmented by a laser drill or routing process.