发明名称 METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
摘要 <P>PROBLEM TO BE SOLVED: To achieve a method for manufacturing a light-emitting diode for preventing bubbles and cracks from occurring in a coating material composed of glass, namely an inorganic material. <P>SOLUTION: In the method for manufacturing a light-emitting diode 10 where an LED chip 16 is coated with a coating material 22 made of water glass having light transmission properties, a surface hardening retarder is added to a water glass material in a solution comprising sodium solicate and water as a solvent, the LED chip 16 is coated with the water glass material, and water, namely a solvent, is evaporated for hardening, thus forming a coating material 22 made of the water glass. As the surface hardening retarder, a solvent having a high boiling point or an organic polymer is used. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010003777(A) 申请公布日期 2010.01.07
申请号 JP20080159894 申请日期 2008.06.19
申请人 OKAYA ELECTRIC IND CO LTD 发明人 RAIKUBO AKIHITO;KATO AKIHIRO
分类号 H01L33/48 主分类号 H01L33/48
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