| 摘要 |
PROBLEM TO BE SOLVED: To reduce the parasitic capacitance of an semiconductor-on-insulator device by providing the semiconductor-on-insulator device with a body contact. SOLUTION: In one embodiment, the invention provides a semiconductor device that includes: a substrate including a semiconductor layer positioned overlaying an insulating layer, the semiconducting layer including a semiconducting body and isolation regions present around a perimeter of the semiconducting body; a gate structure overlaying the semiconducting layer of the substrate, the gate structure present on a first portion on an upper surface of the semiconducting body; and a silicide body contact that is in direct physical contact with a second portion of the semiconducting body that is separated from the first portion of the semiconducting body by a non-silicide semiconducting region. COPYRIGHT: (C)2010,JPO&INPIT |
