发明名称 FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive film deposition method and an inexpensive film deposition apparatus which perform high-temperature anneal of a film or deposit a thermal CVD film on a surface of a substrate while maintaining the substrate at low temperature. Ž<P>SOLUTION: When a plurality of high-temperature gas beams 2b, 2c are blown in a substantially orthogonal direction onto a surface of a substrate 1 adhered to and supported on a supporting stand 4, only the surface of the substrate can be annealed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010001560(A) 申请公布日期 2010.01.07
申请号 JP20080282948 申请日期 2008.11.04
申请人 PHILTECH INC 发明人 FURUMURA YUJI;NISHIHARA SHINJI;MURA NAOMI
分类号 C23C16/56;C23C16/42;C23C16/46;H01L21/205;H01L21/31;H01L21/316;H01L21/318;H01L21/324 主分类号 C23C16/56
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