EPOXY RESIN COMPOSITION

摘要

Disclosed is an epoxy resin composition having good ejectability, which loses fluidity when heated even though the composition has not been cured by energy ray irradiation, and maintains the resin shape right after ejection still after the heat curing.  The epoxy resin composition contains the following members as essential components. Component (A): an epoxy compound Component (B): an epoxy compound into which a (meth)acrylic group is partially introduced Component (C): a (meth)acrylic compound Component (D): an amine curing agent Component (E): a photoinitiator