| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve bonding reliability by reducing the Bi density at the bonding interface regarding a circuit board and its method of manufacturing. <P>SOLUTION: A circuit board includes a wiring substrate having each electrode on its surface, and an electronic component having each bump, facing each electrode, on its surface. A Bi content of a first region in a bonding layer formed in a region between each electrode and each bump and including Sn and Bi is made lower than a Bi content of a second region in the boding layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
