发明名称 METHOD FOR MANUFACTURING SOI SUBSTRATE
摘要 PURPOSE: A method for manufacturing an SOI is provided to increase yield of the SOI substrate with high crystallization by reducing a crystal defect. CONSTITUTION: An insulation layer(102) is formed on a single crystal semiconductor substrate(101). A bromination region(103) is formed on the single crystal semiconductor substrate by irradiating an ion beam to the single crystal semiconductor substrate through an insulation layer. The insulation layer with the bromination region is boned with one side of a support substrate(111). The single crystal semiconductor substrate is separated from the support substrate bonded with a single crystal semiconductor layer(112) by a heat process. The laser light is irradiated to the single crystal semiconductor layer. The surface of the single crystal semiconductor layer is etched. The plasma process is performed on the surface of the single crystal semiconductor layer.
申请公布号 KR20100002130(A) 申请公布日期 2010.01.06
申请号 KR20090055333 申请日期 2009.06.22
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 SASAGAWA SHINYA;KURATA MOTOMU
分类号 H01L21/20 主分类号 H01L21/20
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