发明名称 |
Electrolytic Tin Plating Solution and Electrolytic Tin Plating Method |
摘要 |
A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method. |
申请公布号 |
EP2141261(A2) |
申请公布日期 |
2010.01.06 |
申请号 |
EP20090155197 |
申请日期 |
2009.03.16 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
IMANARI, MASAAKI;TING, FAI LUNG;SHIMAZU, MOTOYA;OHTA, YASUO |
分类号 |
C25D3/30;C25D7/12;C25D17/16 |
主分类号 |
C25D3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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