| 摘要 |
<p>A multi-point probe for testing electrical properties of a number of specific locations of a test sample comprises a supporting body defining a first surface, a first multitude of conductive probe arms (101-101'''), each of the probe arms defining a proximal end and a distal end. The probe arms are connected to the supporting body (105) at the proximal ends, and the distal ends are freely extending from the supporting body, giving individually flexible motion to the probe arms. The probe arms together with the supporting body define lines of contact between each of the probe arms and the supporting body and each of the lines of contact defines a perpendicular bisector being parallel to the first surface. The conductive probe arms originate from a process of producing the multi- point probe including producing the conductive probe arms on the supporting wafer body in facial contact with the supporting wafer body and removal of a part of the wafer body providing the supporting body and providing the conductive probe arms freely extending from the supporting body. Each of the probe arms defines a maximum width perpendicular to its perpendicular bisector and parallel with its line of contact with the supporting body, and a maximum thickness perpendicular to its perpendicular bisector and its line of contact with the supporting body. The maximum width and the maximum thickness define a ratio in the range of 0.5-20, such as 1-10, preferably 1-3, and each of the probe arms has a specific area or point of contact (111-111''') at its distal end for contacting a specific location among the number of specific locations of the test sample. At least one of the probe arms has an extension defining a pointing distal end providing its specific area or point of contact located offset relative to its perpendicular bisector.</p> |
