PRINTED CIRCUIT BOARD EMBEDDED CHIP AND IT'S MANUFACTURING METHOD

摘要

PURPOSE: An electronic component embedded printed circuit board and a manufacturing method thereof are provided to reduce the thickness of the printed circuit board by arranging the electronic component in a boundary of a core layer and a plating layer. CONSTITUTION: An insulation layer(110) forms a core layer. A part of an electronic component(120) is inserted into the insulation layer. A metal seed layer(130) is formed in the insulation layer including a protrusive surface of the electronic component. A plating layer(140) is formed on the metal seed layer. A circuit pattern(114) is electrically connected to a pad of the electronic component through a via hole(151) of the insulation layer. A solder resist layer(150) is formed on the insulation layer. A solder ball(160) is attached on the via hole.