<p>PURPOSE: A semiconductor package using a shape memory alloy is provided to alleviate the warpage of a semiconductor package by inserting a shape memory alloy into a chip area and a semiconductor chip. CONSTITUTION: A semiconductor chip(10) is attached on a chip mounting plate(12) of a lead frame. A wire(16) is connected between the lead(14) of the lead frame and the semiconductor chip. The semiconductor chip and wire is sealed up with a molding compound resin(18). A shape memory alloy plate(24) is formed between the substrate and the semiconductor chip. The warpage is alleviated at a certain temperature through restoring force of a shape memory alloy by applying the heat to the semiconductor package in which the warpage is generated.</p>
