PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve heat radiation by directly bonding a CNT(Carbon Nanotube) heat sink to a first circuit pattern or insulation layer. CONSTITUTION: A groove is formed in an insulation layer(10) with an imprint process. A metal material(20) is formed in one side of the insulation layer and the groove. The metal material is CNT. A first circuit pattern(14) is formed in at least one of the metal material formed in the groove and the other side of the insulation layer. A conductive bump(30) is formed in one side of the first circuit pattern. An insulator(40) buries the first circuit pattern. A second circuit pattern(44) is formed on the insulator.