| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface mount single inline semiconductor device wherein an SIP-type semiconductor device where a plurality of leads are arrayed in a line is surface mounted, being soldered to a mounting board with no tilting. SOLUTION: An element comprising at least such optical element as light emitting element 3 or light receiving element 4 is mounted on one end of a plurality of leads 1 formed as a frame and arrayed on a line, whose periphery is coated with a resin package 6. The other end 2a of a lead 2 is so formed as to form a solder filet 7 for surface mounting while so formed as to form the solder filet 7 at a root 2b of the lead 2 exposed from the resin package 6. As a result, the solder filet 7 is formed at least in two rows (B row and C row) on a soldering surface A.</p> |
