SN-AG-CU SOLDER COMPOSITIONS WITH ADDITION OF BI AND MANUFACTURING METHODS THEREOF

摘要

PURPOSE: A Sn-Ag-Cu solder composition including Bi and a preparation method thereof are provided to prevent sudden melting due to nonuniformity of composition by controlling the melting over a wide temperature range. CONSTITUTION: A Sn-Ag-Cu solder composition including Bi is composed of a mixture of Sn-Bi alloy powder and Sn-Ag-Cu alloy powder, where the content of Bi is 10 weight% or greater, Ag 0.01~3 weight%, and Cu 0.01~1 weight%. The eutectic temperature of Bi-Sn is about 139°C, and the eutectic composition of Bi-Sn is Sn-58Bi.