| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor processing adhesive sheet which comprises an adhesive sheet, in which a rigid base material and an adhesive layer having a low elasticity as well as a large thickness are combined into a layer structure, and a peel film provided thereon, and which is free from creases even after it is wound in a roll shape and stored. SOLUTION: The semiconductor processing adhesive sheet comprises the base material, adhesive layer formed on the base material, and peel film formed on the adhesive layer. The base material has a rigid film in which at least one layer has a Young's modulus of 2,000 MPa or over, the adhesive layer includes a soft adhesive layer having a storage elastic modulus of 1.0×10<SP>5</SP>Pa or less and a thickness of 50μm or over, and the peel film has a Young's modulus of 700 MPa or less. COPYRIGHT: (C)2006,JPO&NCIPI |
