| 摘要 |
PURPOSE: An apparatus for separating a semiconductor chip is provided to damage of a separation unit by preventing collision between a collision detecting part and a separation unit. CONSTITUTION: A clamping unit(110) holds the edge part of an adhesive sheet(14) in which a plurality of semiconductor chips(12) individually separated. A transport unit(120) horizontally transfers the clamping unit. A separation unit(130) is under the adhesive sheet and comprises at least one support pin(132). The separation unit moves vertically to separate one of semiconductor chips selected by the clamping unit. A collision sensor(140) surrounds the separation unit and a switch is operated through press of the clamping unit when the clamping unit is out of a predetermined range. A controller(150) is connected to the collision sensor and control the clamping unit based on the switching of the collision sensor.
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