发明名称 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
摘要 PURPOSE: A method for manufacturing a printed circuit board is provided to block electromagnetic wave emitted from a board to the side by forming a shielding layer on plural unit substrates. CONSTITUTION: A motherboard divided by plural unit boards is provided(S110). A slot is formed along the border of the unit board area in order to form a bridge on a motherboard(S120). A shielding layer is formed on a slot inner wall(S130). The bridge is cut and is separated from the motherboard. The motherboard is plated and a plating layer is formed. A ground circuit is formed in the internal layer of the unit board.
申请公布号 KR20100000242(A) 申请公布日期 2010.01.06
申请号 KR20080059667 申请日期 2008.06.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM, KYOUNG HWAN;KO, YOUNG KUK;YANG, DEK GIN
分类号 H05K3/14;H05K3/40 主分类号 H05K3/14
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