EQUIPMENT FOR CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: Chemical mechanical polishing equipment is provided to prevent generation of a scratch by forming particle balls within a polyurethane matrix. CONSTITUTION: Chemical mechanical polishing equipment comprises a polishing head, a platen, a slurry supply part, and a polishing pad(800). The polishing head rotates the top part of a wafer. The platen is rotated on the bottom part of the wafer corresponding with the polishing head. The slurry supply part supplies slurry to the platen or the wafer rotated on the top part of the platen. Particle balls(810) are randomly formed on the polishing pad. The surface area contacted with the wafer is uniformly maintained within a matrix(830).