| 摘要 |
PURPOSE: A method for sorting semiconductor devices is provided to reduce a total process time by discharging a plurality of first good trays, a plurality of second good trays, at least one first fail tray, and at least one second fail tray at a time. CONSTITUTION: A sawing process about semiconductor devices of a lot unit is performed. The semiconductor devices of the lot unit are loaded in a plurality of good trays(GT) and at least one fail tray(RT) according to a test result. The good trays including good semiconductor devices are loaded in a loading section(S1). An empty tray is loaded in a top part of the good trays loaded in the loading section(S2). The fail tray including fail semiconductor devices is loaded in a top part of the empty tray loaded in the loading section(S3). |
