摘要 |
<p>PURPOSE: A method for transferring a semiconductor device is provided to the improvement of a transfer speed of semiconductor devices by making the alignment of the semiconductor devices simple. CONSTITUTION: Semiconductor devices which are picked up by pickup units(S210). The picked-up semiconductor devices are transferred an unloading position(S220). An image of semiconductor devices is obtained in process of transfer(S230). The position data about one or more edge point and the center spot of each semiconductor devices is obtained from the picked-up image(S240). Semiconductor devices are arranged with the sockets of the tray arranged in the unloading position by using the obtained position data(S250). The arranged semiconductor devices are unloaded in the sockets(S260).</p> |