发明名称 |
ETCHING SOLUTION COMPOSITION |
摘要 |
PURPOSE: An etching solution composition is provided to implement uniform etching by increasing a etch rate without damage to lower film and equipment. CONSTITUTION: In a device, an etchant composites comprises includes H2O2 of 5-30wt%, fluorine containing of 0.1-2wt%, a compound containing the NH4+ salt of 0.55wt%, water. H2O2 oxidizes the surface of an aluminum layer and a titanium layer. A perfluorinated compound etches the oxidized surface of the aluminum layer and the titanium layer. The compound including the NH4+ salt controls the etching of the titanium layer and aluminum layer. The perfluorinated compound is dissociated into fluorine ion and a multi-element fluorine ion.
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申请公布号 |
KR20100001623(A) |
申请公布日期 |
2010.01.06 |
申请号 |
KR20080061607 |
申请日期 |
2008.06.27 |
申请人 |
DONGWOO FINE-CHEM CO., LTD. |
发明人 |
YANG, SEUNG JAE;LEE, HYUN KYU;LIM, MIN KI |
分类号 |
H01L21/3063 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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