发明名称 POLISHING COMPOSITION AND POLISHING PROCESS USING THE SAME
摘要 PURPOSE: A polishing composition is provided to polish a silicon single crystal substrate at a high removal rate, thereby being suitable for polishing a silicon single crystal substrate. CONSTITUTION: A polishing composition comprises grains, piperazine, strong electrolyte salt, and water. The molar ratio of piperazine to strong electrolyte salt is within 0.07-1.2 and the content of piperazine is 0.02 mol/L or more. The content of strong electrolyte salt is 0.03 mol/L or more. The Zeta potential of the polishing composition is more than 40 mV compared with reference slurry consisting of the same kind and amount of grains and the balance of water.
申请公布号 KR20100002120(A) 申请公布日期 2010.01.06
申请号 KR20090053149 申请日期 2009.06.16
申请人 FUJIMI INCORPORATED 发明人 ASAI MAIKO
分类号 C09K3/14;B24B37/00;H01L21/304 主分类号 C09K3/14
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