发明名称 Thermal barrier system
摘要 <p>A thermal barrier system includes a plurality of panels including at least two panels separated from each other so as to define a space between the panels, where each panel of the at least two panels is separated from another panel via at least one spacer structure. Each panel is further formed of an insulation material having a thermal conductivity in the range from about 0.023 W/(m*K) to about 0.099 W/(m*K). In an example embodiment, the insulation material forming the panels has a density of no greater than about 30 lb/ft 3 . In another example embodiment, the insulation material includes a silicone syntactic foam material.</p>
申请公布号 EP2141070(A1) 申请公布日期 2010.01.06
申请号 EP20090162364 申请日期 2009.06.10
申请人 ITT MANUFACTURING ENTERPRISES, INC. 发明人 REMBERT, MICHAEL B.;KISKIRAS, CHARLES JOHN
分类号 B64G1/58;B64C1/40 主分类号 B64G1/58
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