| 摘要 |
<p>PURPOSE: An organic peroxide curable silicone adhesive composition is provided to form an adhesive layer maintaining adhesive force at a high temperature more than 150°C, and to prevent the degradation of retention of the adhesive tape in a moist heating condition. CONSTITUTION: An organic peroxide curable silicone adhesive composition comprises (A) 20-80 parts by mass of linear polydiorganosiloxane, (B) 80-20 parts by mass of polyorganosiloxane containing a R^2_3SiO_0.5 unit(wherein, R^2 is C1-10 monovalent hydrocarbon group) and an SiO2 unit, which has a molar ratio of R^2_3SiO_0.5 unit/SiO2 unit of 0.5-1.0; (C) 0.1-5.0 parts by mass of polyorganosiloxane containing chemical formula 1 and/or 2 based on 100.0 parts by mass of the total of the components (A) and (B); and (D) 0.5-5.0 parts by mass of an organic peroxide hardener based on 100.0 parts by mass of the total of the components (A) and (B).</p> |
