IMAGE SENSOR MODULE EMBEDDED IN THE MOBILE AND MANUFACTURING METHOD THEREOF
摘要
PURPOSE: An image sensor module embedded in a portable terminal and a manufacturing method thereof which equips a flexible PCB are provided to reduce the size of the entire module by mounting a multilayer ceramic condenser on an image sensor chip. CONSTITUTION: A flexible PCB(Printed Circuit Board)(11) includes a plated pattern and a connector. An image sensor chip is connected to the plated pattern and is mounted on the upper side of the flexible PCB and equips the plated pattern. A soft PCB(13) comprises the plated pattern of the image sensor chip and is mounted on the image sensor chip and equips the plated pattern on the upper surface. Mounting devices are connected to the plated pattern of the flexible PCB and is mounted on the upper side of the flexible PCB.
申请公布号
KR20100001799(A)
申请公布日期
2010.01.06
申请号
KR20080061866
申请日期
2008.06.27
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, YOUNG SHIN;SEO, TAE JUN;YEOM, SEUNG JAE;OH, JIN YOUNG