| 摘要 |
PURPOSE: A molding apparatus for manufacturing a semi-conductor package is provided to prevent a defective of a molding by preventing the inflow of epoxy molding compound into a vacuum hole. CONSTITUTION: A low mold(200) has a cavity block. A plurality of vacuum holes are formed in the cavity block. A plurality of vacuum holes vacuum-absorbs the lower-part of a semi-finished package(100). An upper mold(300) has a cavity corresponding to the cavity block. A spring(400) is installed within the lower mold in order to support the cavity block elastically. A plurality of pins(500) are installed within the low mold. When a plurality of pins lifts up the cavity block, a plurality of vacuum holes is opened. When a plurality of pins put downs the cavity block, the plural vacuum holes is closed.
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