| 摘要 |
<p>PURPOSE: A method of aligning a wafer of a semiconductor device is provided to prevent misalignment of a wafer by determining an optimal wavelength of a laser through a first and the second image pick-up. CONSTITUTION: In a device, an irradiation portion(120) radiates a laser of a first wave length on an alignment mark(110a) of a wafer(110). A light receiving unit(130) processes a first image pick-up to detect the laser of the first wave length reflected to the alignment mark. The irradiation unit radiates the laser of the other second wavelength and the first wave length on the alignment mark of the wafer. A light receiving unit performs a second image pick-up to detect a laser of a second wavelength reflected through the alignment mask.</p> |
