| 摘要 |
The lamp has LEDs (3) arranged on a LED carrier (2), and a reflector provided with reflector chambers. The LEDs are arranged in a focal point of the respective chambers, and the carrier is produced as an injection-molded plastic part in molded interconnect devices (MID) procedure. The carrier has conductive paths by which the LEDs are electrically connected. The paths are arranged on a rear side of the carrier, where the rear side is turned away from the reflector. The LEDs are wired LEDs provided with pins, and are soldered on the rear side of the carrier by through plating. |
