A METHOD FOR PROCESSING A SURFACE OF A FLEXIBLE PRINTED CIRCUIT BOARD USING A ELECTROLESS NIKEL-GOLD PLATING

摘要

PURPOSE: A substrate surface treatment method of a soft PCB using electroless nickel-gold plating is provided to improve processing yield by manufacturing a soft PCB which takes the advantage of electroless nickel-gold plating and existing electrolytic gold plating. CONSTITUTION: A degreasing process for removing impurities is performed(S605). An etching process for polishing the surface is performed(S615). A pickling process is performed for removing oxide films(S625). A nickel plating layer is formed by using first plating liquid(S635). A gold plating layer is formed by using second plating liquid(S655).