发明名称 Frame assembly for electrical bond
摘要 A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
申请公布号 US7642975(B2) 申请公布日期 2010.01.05
申请号 US20080046768 申请日期 2008.03.12
申请人 SIKORSKY AIRCRAFT CORPORATION 发明人 BRUNKS RALPH D.;MORTENSEN SCOTT M.
分类号 H01Q1/28 主分类号 H01Q1/28
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