发明名称 |
Frame assembly for electrical bond |
摘要 |
A frame assembly for a composite panel includes a first frame having a first frame contact surface transverse to a first frame mount surface and a second frame having a second frame contact surface transverse to a second frame mount surface, the first frame mount surface receivable within the second frame mount surface to provide a conductive communication path therebetween.
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申请公布号 |
US7642975(B2) |
申请公布日期 |
2010.01.05 |
申请号 |
US20080046768 |
申请日期 |
2008.03.12 |
申请人 |
SIKORSKY AIRCRAFT CORPORATION |
发明人 |
BRUNKS RALPH D.;MORTENSEN SCOTT M. |
分类号 |
H01Q1/28 |
主分类号 |
H01Q1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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