发明名称 |
Integrated circuit component with passivation layer |
摘要 |
A semiconductor component includes a semiconductor chip provided with a passivation layer that covers the topmost interconnect structure of the semiconductor chip whilst leaving contact areas free. The passivation layer is in direct adhesive contact with the plastic housing composition of the semiconductor component. The passivation layer includes a polymer with embedded mineral-ceramic nanoparticles.
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申请公布号 |
US7642641(B2) |
申请公布日期 |
2010.01.05 |
申请号 |
US20070756303 |
申请日期 |
2007.05.31 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;OTREMBA RALF;BETZ BERND;HOSSEINI KHALIL |
分类号 |
H01L23/14;H01L21/52;H01L21/56;H01L23/24;H01L23/29;H01L23/31 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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