| 摘要 |
A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7. A shock absorbing layer is formed on the front surface 7a of the semiconductor integrated circuit substrate 7 at least on a part thereof facing the weight 3 of the semiconductor sensor element 7, for suppressing the bouncing of the weight 3 when the weight 3 collides against the semiconductor integrated circuit substrate 7.
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