发明名称 |
SEMICONDUCTOR DEVICE HAVING A SIMPLIFIED STACK AND METHOD FOR MANUFACTURING THEREOF |
摘要 |
Embodiments of the present invention are directed to provide a semiconductor device including a semiconductor chip formed of a conductive material, a connector terminal around the semiconductor chip, which is formed of a same material for forming the semiconductor chip, an insulating member for electrically insulating the semiconductor chip from the connector terminal, and a first connection member for electrically coupling the semiconductor chip with the connector terminal. Simplified step of manufacturing the connector terminal may further simplify the steps of manufacturing the semiconductor device.
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申请公布号 |
US2009321958(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20080341863 |
申请日期 |
2008.12.22 |
申请人 |
TANAKA JUNJI;TAYA KOJI;HARAYAMA MASAHIKO |
发明人 |
TANAKA JUNJI;TAYA KOJI;HARAYAMA MASAHIKO |
分类号 |
H01L21/768;H01L23/52;H01L25/11 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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