| 摘要 |
A photoelectric conversion device includes a circuit substrate that has a first concave portion having a light transmission hole, a first metal interconnection that is formed from a bottom of the first concave portion to a face of the circuit substrate where the first concave portion is formed, an optical element that is arranged in the first concave portion so that an optical axis thereof passes through the light transmission hole and is flip-chip bonded to the first metal interconnection on the bottom of the first concave portion, and a circuit chip that is a driver circuit chip for driving the optical element or an amplifier circuit chip for amplifying a signal from the optical element and is flip-chip bonded to the first metal interconnection at the face where the first concave portion is formed.
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