| 摘要 |
The invention relates to a method of fabricating an electromechanical structure presenting a first substrate (1) including at least one layer (1') of monocrystalline material covered in a sacrificial layer (2) that presents a free surface, the structure presenting at least one mechanical reinforcing pillar received in said sacrificial layer, the method being characterized in that it comprises: a) making at least one well region (51, 52) in the sacrificial layer (2) by etching, at least in the entire thickness of the sacrificial layer (2), the well region defining at least one said mechanical pillar; b) depositing a first functionalization layer (4, 31) of a first material, relative to which the sacrificial layer is suitable for being etched selectively, the functionalization layer (4) filling at least one well region (51) at least partially and covering the free surface of the sacrificial layer (2) at least around the well region(s); and b') depositing a filler layer (6, 32) of a second material different from the first material for terminating the filling of the well region(s) (5'), said filler layer (6) covering the first functionalization layer (4) at least in part around the well region(s) (5'), and planarizing the filler layer (6, 32), the pillar(s) being formed by the superposition of at least the first material and the second material in the well region(s); and releasing the electromechanical structure by removing at least partially the sacrificial layer (2). The invention also relates to an electromechanical structure obtained by the method.
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