发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.
|
申请公布号 |
US2009321109(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090352090 |
申请日期 |
2009.01.12 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HWANG JUN-OH;MOK JEE-SOO;PARK JUN-HEYOUNG;LEE KYUNG-AH;LEE EUNG-SUEK |
分类号 |
H05K7/20;H05K3/10 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|