发明名称 MOLD CLAMPING DEVICE
摘要 A mold clamping device uses an electromagnet to generate clamping force. In the mold clamping device, a coil holding member holds a coil which constitutes a part of the electromagnet. A coil placement part is arranged in a surface of the coil holding member to place the coil therein, wherein the coil is embedded in the coil placement part by a molding material. The mold clamping device is able to cool the coil of the electromagnet appropriately.
申请公布号 US2009324762(A1) 申请公布日期 2009.12.31
申请号 US20070310327 申请日期 2007.11.06
申请人 MORITANI KOUJI;TOKUI YOSUKE 发明人 MORITANI KOUJI;TOKUI YOSUKE
分类号 B29C33/20 主分类号 B29C33/20
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