PACKAGING SUBSTRATE USING METAL CORE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A package substrate using a metal core and a manufacturing method thereof are provided to eliminate a need for processing a via hole, thereby minimizing loss of the metal core. CONSTITUTION: Plural metal cores(101) are separated from one another by partition grooves(104). Insulating layers are formed on both sides of the metal cores by including the partition grooves. First circuit layers(111a) and second circuit layers(111b) include circuit patterns and lands formed on the insulating layers. Vias(113a, 113b) connect the metal cores with the lands. Build-up layers include the plural circuit layers and the plural insulating layers. Solder resist layers are formed on the outermost layers of the build-up layers.