EPOXY BLEEDOUT-PREVENTING AGENT AND METHOD, WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE

摘要

Disclosed is an epoxy bleedout-preventing agent which has no adverse effect on die bonding strength and assembly characteristics and does not deteriorate effects of coloration preventing treatment and sealing even when a low-stress die bonding resin is used. Specifically disclosed is an epoxy bleedout-preventing agent for die bonding processes, which is characterized by containing a fluorine-containing organic compound having a fluorohydrocarbon group CxHyFz-(wherein x = 3-24, y = 0-48, z = 1-49, and y + z = 2x + 1) having 3-24 carbon atoms and a polar group R-.