发明名称 |
ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTICLES, AND METHOD FOR CONNECTING CIRCUIT BOARD USING THE SAME |
摘要 |
To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition.
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申请公布号 |
US2009321015(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20070304577 |
申请日期 |
2007.06.18 |
申请人 |
KAWATE KOHICHIRO;YAMAGUCHI HITOSHI;KIKUCHI NORIKO;HARA TOMIHIRO;OHKURA YOSHIYUKI |
发明人 |
KAWATE KOHICHIRO;YAMAGUCHI HITOSHI;KIKUCHI NORIKO;HARA TOMIHIRO;OHKURA YOSHIYUKI |
分类号 |
B32B7/12;C08K5/3445 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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