HEAT DISSIPATION DEVICE

摘要

A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly.