| 发明名称 |
PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein is a printed circuit board with embedded capacitors therein which comprises inner via holes filled with a high dielectric polymer capacitor paste composed of a composite of BaTiO3 and an epoxy resin, and a process for manufacturing the printed circuit board.
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| 申请公布号 |
US2009325105(A1) |
申请公布日期 |
2009.12.31 |
| 申请号 |
US20090491406 |
申请日期 |
2009.06.25 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SEOK-KYU;MIN BYOUNG-YOUL;NAM CHANG-HYUN;JIN HYUN-JU;KANG JANG-KYU |
| 分类号 |
H05K3/46;G03F7/00;H05K1/16 |
主分类号 |
H05K3/46 |
| 代理机构 |
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