发明名称 |
Securing integrated circuit dice to substrates |
摘要 |
A conductive material may be jet dispensed (i.e. jet sprayed) on an integrated circuit die and a bond pad to form a conformal electrical connection on and between the bond pad and the die. In some cases, a smaller package footprint and/or height may result.
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申请公布号 |
US2009321955(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20080215860 |
申请日期 |
2008.06.30 |
申请人 |
HOULE SABINA;SWAN JOHANNA;GEORGE KEVIN |
发明人 |
HOULE SABINA;SWAN JOHANNA;GEORGE KEVIN |
分类号 |
H01L23/488;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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